Newsletter outlines 2019
successful effort to scale the 然axPak packaging technology to higher
voltages and currents.
Published article detailing the
high power levels, the performance, the be nefits, and the development
needed to reach those levels.
Published article answering
questions that inquirers have asked ask the inventor since the 然axPak
A summary of the basic 然axPak
technology citing semiconductor switch assembly variations and their
A detailed presentation that
introduced the 然axPak to the power electronics industry at APEC
The basic 然axPak
Inventor shares his experience
product packaging designing, process designing, and manufacturing that
led to his combining Power QFN and high current module designs to
create the 然axPak packaging technology.
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